Chip InnovationForum

Collaboration Models

Between Taiwan and Europe for IC Design

1/4

SEP. 9-10 2026SEP. 9-10 2026

AGENDA

DAY-1

SEP. 9

08:30 - 12:00

TW-EU Session / TSRI & imec Session

13:00 - 17:00

Industry Session / NIAR Session

DAY-2

SEP. 10

08:30-12:00

Smart Sensing / Compound Semiconductor / Emerging Materials and Device Integration: Oxide & 2D / Monolithic 3D device and integration Session

13:00 - 17:30

Silicon Photonics and Advanced Packaging / TW-EU Session

DAY-1

SEP. 9

08:30 - 12:00

TW-EU Session / TSRI & imec Session

13:00 - 17:00

Industry Session / NIAR Session

DAY-1

SEP. 9

The key industry companies across the entire value chain from Taiwan and Europe in the fields of R&D, design, manufacturing, and applications, will be important participants and experience sharers in this Forum. Furthermore, TSRI, imec, and EUROPRACTICE will also share their past approaches and experiences in serving Taiwanese and European industries and academic professors. More importantly, they will propose support programs tailored to the future needs of the industry.

DAY-2

SEP. 10

08:30-12:00

Smart Sensing / Compound Semiconductor / Emerging Materials and Device Integration: Oxide & 2D / Monolithic 3D device and integration Session

13:00 - 17:30

Silicon Photonics and Advanced Packaging / TW-EU Session

DAY-2

SEP. 10

Day two focuses on long-term collaboration between research institutes, universities, and industry partners, with sessions covering talent development, technology transfer, and future ecosystem needs.

Who will be the Speaker?

INFORMATION

Antwerp, Belgium Hilton Antwerp Old Town (Groenplaats 32, 2000 Antwerp, Belgium)

PREVIOUS EDITIONS

Collaboration Models Between Taiwan and Europe for IC Design

TECIF 2024

TECIF 2024 focused on strengthening Taiwan–Europe collaboration in IC design through knowledge exchange and international partnership. The forum explored emerging IC design technologies, advanced circuit design, and system applications while addressing future technology and talent challenges.

Collaboration Models Between
Taiwan and Europe for IC Design

Cultivating Global Talent for the Future of Semiconductors

TECIF 2025

TECIF 2025 brought together leaders from industry, academia, and government to explore semiconductor innovation, talent cultivation, and Taiwan–Europe collaboration. The forum highlighted advancements in advanced packaging, silicon photonics, smart sensing, advanced devices, and emerging memory technologies.

Cultivating Global Talent for the
Future of Semiconductors