08:30 - 09:00
Registration/ Welcome Coffee/ Networking
Agenda
SEP. 9 2026SEP. 9
2026
( DAY1 )DAY
1
PROGRAM
Key leaders and industry pioneers across the Taiwan–Europe value chain gather to share insights. TSRI and imec will show their services and collaborative models, while NIAR and its affiliated centers showcase cutting-edge research to drive cross-domain innovation and future ecosystem growth.
09:00 - 09:30
Opening Remarks
09:30 - 10:00
Keynote I
The Photonic Fabric, a heterogeneous integration challenge
Philippe Absil/ Vice President, IC-Link | imec silicon solutions/ imec
10:00 - 10:30
Keynote II
The future of semiconductor-related academic research in Europe
Bart Smolders/ Scientific Director | Professor of Casimir Institute/ Eindhoven University of Technology
10:30 - 11:30
TW-EU Session I
- Ying-Chyi Chou/ Director of the Science & Technology Division/ Taipei Representative Office in the EU and Belgium
- Chien-Nan Liu/ Director General/ TSRI, NIAR
- Pierre Chastanet/ Head of Unit, Microelectronics and Photonics/ DG CONNECT
- Romano Hoofman/ Strategic Development Director, General Manager/ imec, EUROPRACTICE
- Lin-Lin Chen/ Professor and chair of Design Innovation Strategy/ Eindhoven University of Technology
- Weileun Fang/ Chair Professor/ NTHU
11:30 - 13:00
Lunch
13:00 - 13:30
Keynote III
How UMC prepares ourselves for the next decade?
Wenchi Ting/ Vice President/ UMC
13:30 - 14:00
Keynote IV
Leverage RISC-V to Strengthen Your High Tech Competitiveness
Frankwell Lin/ Chairman & CEO/ Andes Technology Corporation
14:00 - 15:00
Industry Session
14:00
14:20
Scale the Square: Enabling the Endless of Heterogeneous Integration
Frank Su/ Senior Director, Business Development GPG/ Lam Research
14:20
14:40
From Cloud to Edge: Building the Future of AI on Arm
Neil Parris/ Commercial Director/ Arm
14:40
15:00
LCoS for AR and AI
Simon Fan Chiang/ Senior Director/ Himax Technologies, Inc.
15:00 - 15:30
Coffee Break
15:30 - 16:30
Industry Session
15:30
15:50
Germanium-Silicon Photonics Technologies: Past, Present, and Future
Neil Na/ Co-Founder & CTO/ Artilux Inc.
15:50
16:10
Quality Innovation Across the AI Chip-to-Rack Stack
Charles Lin/ Senior Application & Business Development Manager/ CARL ZEISS CO. Ltd
16:10
16:30
From MPW (Multi-Project Wafer) Wafer to Silicon Validation
Ching-Chun Lin/ Manager/ iST
16:30 - 17:30
NIAR Session
- Melissa Chen/ Director/ International Affairs Office, NIAR
- Chien-Nan Liu/ Director General/ TSRI, NIAR
- CHUAN TSE TSAI/ Assistant Researcher/ NCHC, NIAR
- Chi-Chung Kei/ Research Fellow & Division Director/ NCIR, NIAR
- Yu-Chen Ou/ Director General/ NCREE, NIAR
18:00 - 20:00
VIP Dinner
Agenda
SEP. 10 2026SEP. 10
2026
( DAY2 )DAY
2
PROGRAM
Day 2 features TSRI’s Special Interest Groups (SIG) and Joint Research Center (JRC) initiatives, bridging Taiwan and international semiconductor communities. Experts across academia and industry will showcase joint achievements in silicon photonics, advanced packaging, smart sensing, compound semiconductors, emerging materials, and 3D integration to foster long-term research partnerships and talent mobility.
08:30 - 09:00
Registration/ Welcome Coffee/ Networking
09:00 - 10:30
SIG Session
Smart Sensing
INTRO
Sheng-Hsiang Tseng/ TSRI, NIAR Cheng-Yang Chang/ TSRI, NIAR
Scaling Impact in CMOS-MEMS and Inkjet-Printed Environmental Sensors
Weileun Fang/ Chair Professor/ NTHU
An Approach towards efficient Piezo MEMS
Alfons Dehé/ Georg H. Endress Professor/ University of Freiburg
Microwave Transduction: A Versatile Technology for Embedded Sensing Applications
Jerome Rossignol/ Professor/Université de Bourgogne
CMOS-MEMS Sensor Platform Development: An Experience in Taiwan-Japan Collaboration
Ming-Huang Li/ Associate Professor/ NTHU
Emerging Materials and Device Integration: Oxide & 2D
INTRO
Chao-Cheng Lin/ TSRI, NIAR
Advanced Memory Technologies for Energy-Efficient AI Accelerators: From Ultra-High-k Devices to IGZO In-Memory Logic Architectures
Ying-Tsan Tang/ Professor/ NCU
Enabling Angstrom-Era CMOS Scaling with Two-Dimensional Nanosheet Transistors
Tsung-En Lee/ Assistant Professor/ NYCU
Emerging MRAM and Oxide Semiconductor Technologies for Low-Voltage and High-Density On-Chip Memory
Elia Ambrosi/ Technical Manager/ TSMC
Two-Dimensional Transistors for Ultra-Low-Power Electronics: Driving Innovation through International Collaboration
Lain-Jong (Lance) Li/ Professor/ NUS
Advancing 2D Materials Toward Electronic Devices and Applications
Pierre Morin/ Scientific Director/ imec
10:30 - 10:50
Coffee Break
10:50 - 12:20
SIG Session
Compound Semiconductor
INTRO
Lung-Hsing Hsu/ TSRI, NIAR
Powering AI Data Centers — Power Semiconductors from Grid to Chips
Wai Tung Ng/ Professor/ UofT
Emerging Directions in III-N Electronics for RF and mm-Wave Applications
Patrick Fay/ Professor/ University of Notre Dame
Advancing Wide-Bandgap Semiconductor Technologies through Academia–Research Institute–Europe Collaboration
Tian-Li Wu/ Professor/ NYCU
Wide- and Ultra-Wide-Bandgap Semiconductors: Shaping the Future of AI Data Centres and Net Zero
Nazareno Donato/ Professor/ University of Cambridge
Monolithic 3D device and integration
INTRO
Chih-Chao Yang/ TSRI, NIAR
The Rise of 2D Electronics: from Device Fundamentals to Monolithic 3D Integration
Chao-Hui Yeh/ Assistant Professor/ NTHU
Evolution of IGZO for BEoL CFET Application: From Planar Structures to High-Current Vertically Stacked GAA Devices
Yao-Jen Lee/ Professor/ NYCU
BEoL-Integrated Ferroelectric Memories: From Planar CMOS Nodes to Advanced FinFET and GAA Platforms
David Lehninger/ Project Manager/ Fraunhofer IPMS
12:20 - 13:20
Lunch
13:20 - 15:40
SIG Session
Silicon Photonics and Advanced Packaging
HOST
Hann-Huei Tsai/ Deputy Director General/ TSRI, NIAR
INTRO
Yu-Ting Chuang/ TSRI, NIAR
Peter Ossieur/ Director, XTCO Fabric and Optical Interconnect/ imec
3D Integration & packaging technologies for high bandwidth Optics
Philippe Soussan/ Technology Portfolio Director/ imec
AI-Native Co-Design for CoWoS and CPO: InPack.AI and NeuroFEM
Chi-Hua Yu/ Associate Professor/ NCKU
Always-On Vision AI for Next-Generation Edge Intelligence Powered by Single-Digit mW AI Processor and Low-Power CIS
Samuel Kuo/ Associate Vice President/ Himax Technologies, Inc.
Recent Research Progress in Developing the Radiation-Tolerant Chips in NTU RTRC
Jia-Han Li/ Professor/ NTU
JRC Session
JRC 201 Manufacturing
Shu-Ping Lin/ Professor/ NYCU Zdeněk Lokaj/ Professor/ CTU
JRC 202 Digital IC Design
Lih-Yih Chiou/ Professor/ NCKU Zdeněk Lokaj/ Professor/ CTU
JRC 203 Manufacturing
Kung-Yen Lee/ Professor/ NTU Pavel Hazdra/ Professor/ CTU
JRC 204 Silicon Photonics
Shu-Fan Lee/ NTUST Vítězslav Jeřábek/ Professor/ CTU
JRC 205 Smart Sensing
Poki Chen/ Professor/ NTU Pavel Ripka/ Professor/ CTU
JRC 206 Smart Sensing
Chiung-Jen Sun/ NTHU Alexandr Laposa/ Professor/ CTU
JRC 207 Smart Sensing
Yen-Yun Huang/ NYCU Vladimir Janicek/ Professor/ CTU
15:40 - 16:00
Coffee Break
16:00 - 17:00
TW-EU Session II
- Hann-Huei Tsai/ Deputy Director General/ TSRI, NIAR
- Romano Hoofman/ Strategic Development Director, General Manager/ imec, EUROPRACTICE
- Chau-Chin Su/ Chief Human Resources Officer/ NSTC
- Timo Hämäläinen/ Professor/ University of Tampere
- Yu-Sheng Lai/ Division Director/ TSRI, NIAR
17:00 - 17:10
Closing Remarks
- Chien-Nan Liu/ Director General/ TSRI, NIAR