Organizer
1/1
Key leaders and industry pioneers across the Taiwan–Europe value chain gather to share insights. TSRI and imec will show their services and collaborative models, while NIAR and its affiliated centers showcase cutting-edge research to drive cross-domain innovation and future ecosystem growth.
Day 2 features TSRI’s Special Interest Groups (SIG) and Joint Research Center (JRC) initiatives, bridging Taiwan and international semiconductor communities. Experts across academia and industry will showcase joint achievements in silicon photonics, advanced packaging, smart sensing, compound semiconductors, emerging materials, and 3D integration to foster long-term research partnerships and talent mobility.
SEP. 9-10 2026SEP. 9-10 2026
08:30 - 12:00
TW-EU Session / TSRI & imec Session
13:00 - 17:00
Industry Session / NIAR Session
08:30-12:00
Smart Sensing / Compound Semiconductor / Emerging Materials and Device Integration: Oxide & 2D / Monolithic 3D device and integration Session
13:00 - 17:30
Silicon Photonics and Advanced Packaging / TW-EU Session
Meet the Speakers
Antwerp, Belgium Hilton Antwerp Old Town (Groenplaats 32, 2000 Antwerp, Belgium)
TECIF 2024 focused on strengthening Taiwan–Europe collaboration in IC design through knowledge exchange and international partnership. The forum explored emerging IC design technologies, advanced circuit design, and system applications while addressing future technology and talent challenges.
TECIF 2025 brought together leaders from industry, academia, and government to explore semiconductor innovation, talent cultivation, and Taiwan–Europe collaboration. The forum highlighted advancements in advanced packaging, silicon photonics, smart sensing, advanced devices, and emerging memory technologies.
